UTEC adds SBP to GAVIA AUV

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GAVIA undergoing sub-bottom profile modue acceptance testing. UTEC Survey photo.

Offshore staff

HOUSTON – UTEC Survey has successfully completed a systems acceptance test of a sub-bottom profiles module for the GAVIA AUV. The addition of the Teledyne Benthos Chirp III gives the AUV the capability to do pre-engineering surveys for subsea pipelines, umbilical, and cable routes.

The GAVIA AUV’s design allows the end-user to attach an individual sensor package or a combination of packages, including multi-beam (MBES), side-scan (SSS) or sub-bottom profiler (SBP), along with an inertial navigation module, says Trevor Hughes, director of Sales and Marketing.

04/05/2011



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