EP17HT-100 single-part epoxy system cures in 60 to 90 min at 200° to 220° F. to serve potting, encapculation, bonding, and sealing.
With a low heat curing schedule, the epoxy is especially useful in bonding of temperature-sensitive substrates. The moderate viscosity compound has good flow properties. It can be cast in sections up to 1/2-in. thick and is not premixed and frozen for unlimited working life at room temperature.